发明名称 |
CVD diamond enhanced microprocessor cooling system |
摘要 |
Cooling systems for microprocessors are addressed. Some systems may include a chemical vapor deposited (CVD) diamond heatspreader mounted to a base of a heat sink and to a microprocessor chip, while others may include a copper insert mounted within a depression of a heat sink, with the CVD diamond heatspreader mounted within an indent of the insert.
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申请公布号 |
US7339791(B2) |
申请公布日期 |
2008.03.04 |
申请号 |
US20040466377 |
申请日期 |
2004.01.13 |
申请人 |
MORGAN ADVANCED CERAMICS, INC. |
发明人 |
HOOVER DAVID S.;PETKIE RONALD R. |
分类号 |
H05K7/20;H01L23/373;H01L23/467 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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