发明名称 CVD diamond enhanced microprocessor cooling system
摘要 Cooling systems for microprocessors are addressed. Some systems may include a chemical vapor deposited (CVD) diamond heatspreader mounted to a base of a heat sink and to a microprocessor chip, while others may include a copper insert mounted within a depression of a heat sink, with the CVD diamond heatspreader mounted within an indent of the insert.
申请公布号 US7339791(B2) 申请公布日期 2008.03.04
申请号 US20040466377 申请日期 2004.01.13
申请人 MORGAN ADVANCED CERAMICS, INC. 发明人 HOOVER DAVID S.;PETKIE RONALD R.
分类号 H05K7/20;H01L23/373;H01L23/467 主分类号 H05K7/20
代理机构 代理人
主权项
地址