发明名称 Method of depositing a layer of a material on a substrate
摘要 The present invention makes it possible to precisely deposit a material adjacent a feature on a substrate. A layer of the material is deposited on the substrate. The layer is planarized and exposed to an etchant. The etchant is adapted to selectively remove the material. The exposing of the layer to the etchant is stopped prior to a complete removal of the layer.
申请公布号 US7338872(B2) 申请公布日期 2008.03.04
申请号 US20040009825 申请日期 2004.12.10
申请人 ADVANCED MICRO DEVICES, INC. 发明人 SCHWAN CHRISTOPH;FEUDEL THOMAS;KAMMLER THORSTEN
分类号 H01L21/336;H01L21/28;H01L21/311;H01L21/3213;H01L29/417 主分类号 H01L21/336
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