发明名称 |
Method of depositing a layer of a material on a substrate |
摘要 |
The present invention makes it possible to precisely deposit a material adjacent a feature on a substrate. A layer of the material is deposited on the substrate. The layer is planarized and exposed to an etchant. The etchant is adapted to selectively remove the material. The exposing of the layer to the etchant is stopped prior to a complete removal of the layer.
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申请公布号 |
US7338872(B2) |
申请公布日期 |
2008.03.04 |
申请号 |
US20040009825 |
申请日期 |
2004.12.10 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
SCHWAN CHRISTOPH;FEUDEL THOMAS;KAMMLER THORSTEN |
分类号 |
H01L21/336;H01L21/28;H01L21/311;H01L21/3213;H01L29/417 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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