A package for an IC includes a carrier with a cavity formed on one of the major surfaces. Bumps of a semiconductor die are mated to contact pads located on the bottom of the cavity. The die is attached to the major surface of the carrier. The major surface creates a support which securely holds the chip in place with adhesive for assembly.
申请公布号
US7339278(B2)
申请公布日期
2008.03.04
申请号
US20060536635
申请日期
2006.09.28
申请人
UNITED TEST AND ASSEMBLY CENTER LTD.
发明人
IKSAN HENRY;KIM SEONG KWANG BRANDON;TANARY SUSANTO;TAN HIEN BOON;SUN YI SHENG ANTHONY