A jig assembly is provided to perform a stable operation in a semiconductor package treatment process by moving and fixing easily a semiconductor package. A jig(310) includes a slit into which a semiconductor package is inserted. A body includes a jig loading part. The jig is loaded into the jig loading part. A jig clamping unit is formed at both edges of the jig loading part to adjust a size of the slit of the jig. The jig includes an adjusting part and an elastic member. The adjusting part slides in a longitudinal direction of the slit to adjust the size of the slit. The elastic member is used for supporting elastically the adjusting part in a reducing direction of the size of the slit. The jig clamping unit includes a mobile member inserted into an adjusting hole of the adjusting part and a driving member for moving the mobile member.
