发明名称 METHOD AND APPARATUS FOR REDUCING SURFACE DEFECTS IN MICROSTAMPS
摘要 A removal assembly and method for removing a submaster from a master is described. A curved tooling surface is arranged within a housing of the assembly. A first array of vacuum cups is attached to the housing adjacent a first end of the curved tooling surface, where the first array of vacuum cups are configured to provide a vacuum grip on a first portion of the submaster. A second array of vacuum cups is attached to the housing adjacent a second end of the curved tooling surface, where the second end opposes the first end, the second array of vacuum cups is configured to provide a vacuum grip on a second portion of the submaster. A rotation mechanism is configured to rotationally support the master as the master is rolled along the curved tooling surface to remove the submaster. ® KIPO & WIPO 2008
申请公布号 KR20080019574(A) 申请公布日期 2008.03.04
申请号 KR20077019728 申请日期 2007.08.29
申请人 GENERAL ELECTRIC COMPANY 发明人 EDWARDS RICHARD;LIANG ERWIN;HAYDEN HARLAND;SORENSEN DONALD;CHEN ALVIN;COYLE DENNIS
分类号 G01N21/00;B81C1/00;G02B27/00 主分类号 G01N21/00
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