发明名称 |
Electroplating chemistries and methods of forming interconnections |
摘要 |
A method comprising forming an interconnection opening through a dielectric material to a contact point; and electroplating a interconnection comprising copper in the contact opening using an electroplating bath comprising an alkoxylated sulfopropylated alkylamine. A method comprising forming an interconnection opening through a dielectric material to a contact point; lining the interconnection opening with a barrier layer and a seed layer; and electroplating an interconnection comprising copper in the contact opening using an electroplating bath comprising an alkoxylated sulfopropylated alkylamine.
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申请公布号 |
US7338585(B2) |
申请公布日期 |
2008.03.04 |
申请号 |
US20060383925 |
申请日期 |
2006.05.17 |
申请人 |
INTEL CORPORATION |
发明人 |
AKOLKAR ROHAN N.;DUBIN VALERY M. |
分类号 |
C25D5/02;C25D3/38;C25D7/12 |
主分类号 |
C25D5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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