A nest unit and a cleaning system thereof are provided to enhance cleaning efficiency and to reduce an error rate by minimizing a shielding area of a semiconductor package in a cleaning process. A cleaning dry unit(650) includes a predetermined device for removing foreign materials from a semiconductor package. A nest unit(620) includes a nest which is formed with a cover and a base part. A plurality of semiconductor packages are fixed to the nest. A nest transfer unit transfers horizontally the nest to the cleaning dry room. The nest transfer unit includes a guide having a guiding groove to guide a horizontal movement of the nest. The nest transfer unit includes a transfer table for loading the nest and a transfer table driving unit for moving the transfer table by providing power.
