SURFACE-MOUNTED CHIP TYPE ELECTRONIC DEVICE AND FABRICATION METHOD THEROF

摘要

A surface mount chip type electronic device and a fabrication method thereof are provided to prevent leakage of magnetic flux by sealing an external electrode through a termination process of the external electrode. A surface mount chip type electronic device includes a core body(10), a metal coil, a cover(30), and an external electrode(40). The core body has a cylindrical ring-shaped groove for inserting the coil inside. The cylindrical metal coil is inserted into the ring-shaped groove inside the core body. The cover is stacked on an upper part of the core body. The external electrode is formed on an outer surface of the core body. The surface mount chip type electronic device further includes an insulating layer formed on a region other than the external electrode of the outer surface of the core body.