WAFER DICING DEVICE AND METHOD

摘要

WAFER DICING DEVICE AND METHOD Methods and devices for cutting workpieces, which include a laseradapted to at least partially cut a workpiece, are described. The workpiece is a wafer having a plurality dies each with an integrated circuit. A mechanicalcutter follows the laser and engages the workpiece. An embodiment of the mechanical cutter includes a cutting blade adapted to complete a cut through a workpiece. Amethod includes a two-pass cutting procedure. The first pass is made by a laser, which scribes the workpiece. The second pass is made by the mechanical cutter. In an embodiment, the mechanical cutter follows the scribe created by the laser. In an embodiment, the work-piece is supported by a table.The workpiece moves relative to the laser and the mechanical cutter.