| 摘要 |
An SIP(System In Package) module is provided to reduce a manufacturing cost by removing a transfer molding process. An SIP module includes a circuit substrate(21), a chip scale package(22), at least one passive element(23), and plural solder balls(24). The circuit substrate includes upper and lower surfaces, and an intermediate circuit having circuit patterns and via holes therein. The chip scale package is flip-chips bonded to connect with the intermediate circuit connected to the upper surface and includes a protection layer. The passive elements are mounted to connect with the intermediate circuit formed on one area of the lower surface. The solder balls are installed on the other area of the lower surface. |
