摘要 |
A light emitting diode module is provided to improve a beam angle of an LED emission light by attaching a lens to cover a peripheral region of a printed circuit board which is mounted on a package. A light emitting diode module includes a printed circuit board(101), at least one LED package(100), and a lens. The LED package(100) is surface-mounted on the printed circuit board(101). The lens is attached on the printed circuit board so as to cover the whole top surface of the LED package(100) and a part of the top surface of the printed circuit board(101) adjacent to the LED package(100). The LED package(100) includes an LED package body part(104) having a mounting region, an LED chip(102) mounted on the mounting region, and a resin packaging part(105) to seal the LED chip(102). |