SOLDER PASTE

摘要

A LEAD-FREE SOLDER PASTE COMPRISES AN SN-ZN BASED LEAD-FREE SOLDER POWDER MIXED WITH A FLUX. THE FLUX CONTAINS AT LEAST ONE AROMATIC HYDROXYCARBOXYLIC ACID SELECTED FROM THE GROUP CONSISTING OF AROMATIC CARBOXYLIC ACIDS HAVING ONE HYDROXYL GROUP IN A META POSITION (SUCH AS 3-HYDROXY-2-METHYLBENZOIC ACID ) AND AROMATIC CARBOXYLIC ACIDS HAVING AT LEAST TWO HYDROXYL GROUPS (SUCH AS DIHYDROXYNAPHTHOIC ACID OR DIHYDROXYBENZOIC ACID) IN AN AMOUNT OF 0.1-10.0 MASS%.THE FLUX MAY FURTHER INCLUDE 0.5-20 MASS% OF AN ALIPHATIC HYDROXY CARBOXYLIC ACID (SUCH AS HYDROXYOLEIC ACID).