发明名称 IMPRINTING STAMP FOR FORMING PATTERN AND METHOD OF FABRICATING LED PACKAGE USING THE SAME
摘要 An imprinting stamp for forming a pattern is provided to improve light extraction efficiency of an LED package by securely and easily embodying an unevenness pattern of a sufficient aspect ratio on the surface of a resin package part of an LED package. A plurality of unevenness pattern lines are formed on one surface of an imprinting stamp(100) wherein the unevenness pattern line is discontinuously extended on the one surface of the imprinting stamp. The imprinting stamp can be a soft stamp made of a polymer material. The unevenness pattern line can be extended in a direction of the minor axis of an LED package using the imprinting stamp.
申请公布号 KR100809212(B1) 申请公布日期 2008.02.29
申请号 KR20060096229 申请日期 2006.09.29
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 CHANG, MYUNG WHUN;LEE, JONG MYEON;WON, HYONG SIK;PARK, YOUN GON;LEE, HAI SUNG;MAENG, IL SANG
分类号 H01L33/54 主分类号 H01L33/54
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