METHOD FOR THE REMOVAL OF DOPED SURFACE LAYERS ON THE BACK FACES OF CRYSTALLINE SILICON SOLAR WAFERS
摘要
<p>The invention relates to a method for the one-sided removal of a doped surface layer on rear sides of crystalline silicon solar wafers. In accordance with the object set, doped surface layers should be able to be removed from rear sides of such solar wafers in a cost-effective manner and with a handling which is gentle on the substrate. In addition, the front side should not be modified. In accordance with the invention, an etching gas is directed onto the rear side surface of silicon solar wafers with a plasma atmospheric pressure.</p>
申请公布号
EP1891683(A1)
申请公布日期
2008.02.27
申请号
EP20060761679
申请日期
2006.06.14
申请人
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.;CENTROTHERM PHOTOVOLTAICS AG
发明人
HEINTZE, MORITZ;MOELLER, RAINER;WANKA, HARALD;LOPEZ, ELENA;HOPFE, VOLKMAR;DANI, INES;ROSINA, MILAN