| 摘要 |
An apparatus for cooling a semiconductor device is provided to easily transfer the heat generated from a semiconductor device to a heat exchange part by making the heat exchange part come in contact with the upper surface of the semiconductor device even if the semiconductor device is tilted wherein the heat exchange part runs in parallel with the upper surface of the semiconductor device. A body part(10) can vertically transfer toward a semiconductor device placed on a test apparatus wherein the semiconductor device is electrically tested. A heat exchange part(30) comes in contact with the upper surface of the semiconductor device to absorb the heat generated from the semiconductor device, coupled to the body part. An elevation apparatus transfers the body part, coupled to the body part. The heat exchange part is coupled to the body part in a manner that the heat exchange part can rotate according to a tilt angle of one axial direction of the semiconductor device when the heat exchange part comes in contact with the semiconductor device. The rotation center of the heat exchange part can be positioned on the contact surface of the heat exchange part in contact with the semiconductor device.
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