| 摘要 |
A semiconductor package is provided to reduce a manufacturing time thereof and to enhance productivity by attaching a sealing die on an upper surface of the base substrate to protect a semiconductor chip and a conductive wire. A base substrate(10) includes a plurality of bonding pads(12) which are arranged on one side thereof. The base substrate includes an external connecting terminal. A semiconductor chip(100) is attached on an upper surface of the base substrate. A plurality of bumps are arranged on one side of the semiconductor chip. A conductive wire(110) is formed to connect electrically bumps of the semiconductor chip with the bonding pads of the base substrate. A sealing die(140) includes a receiving groove formed on a surface facing the semiconductor chip in order to receive the conductive wire. The sealing die is attached on the upper surface of the base substrate in order to protect the semiconductor chip and the conductive wire.
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