| 摘要 |
A rapid thermal processing apparatus is provided to prevent deterioration of temperature uniformity due to interference of radiant heat irradiated from adjacent lamps, by heating a wafer in uniform temperature distribution. A rapid thermal processing apparatus include a process chamber rotatably supporting a wafer, and a heating unit(1) installed on an upper portion of the process chamber for heating a wafer. The heating unit has plural ramps irradiating radiant heat onto the wafer, at least one lamp support(30) disposed outside the lamps, a lamp receiving portion(40) provided in the lamp support and separated from the adjacent lamps by a partition, and a reflective plate(45) reflecting the radiant heat irradiated from the lamps to the wafer. Each partition of the lamp receiving potion is sloped so that the radiant heat is overlapped over a predetermined section.
|
