发明名称 |
Integrated micro electro-mechanical system and manufacturing method thereof |
摘要 |
In the manufacturing technology of an integrated MEMS in which a semiconductor integrated circuit (CMOS or the like) and a micro machine are monolithically integrated on a semiconductor substrate, a technology capable of manufacturing the integrated MEMS without using a special process different from the normal manufacturing technology of a semiconductor integrated circuit is provided. A MEMS structure is formed together with an integrated circuit by using COMS integrated circuit process. For example, when forming an acceleration sensor, a structure composed of a movable mass (109), an elastic beam (110) and a fixed beam (111) is formed by using the CMOS interconnect technology. Thereafter, an interlayer dielectric (112) and the like are etched by using the CMOS process to form a cavity (115). Then, fine holes (113) used in the etching are sealed with a dielectric (116). |
申请公布号 |
EP1695937(A3) |
申请公布日期 |
2008.02.27 |
申请号 |
EP20050255278 |
申请日期 |
2005.08.26 |
申请人 |
HITACHI, LTD. |
发明人 |
FUKUDA, HIROSHI;FUJIMORI, TSUKASA;YOKOYAMA, NATSUKI;HANAOKA, YUKO;MATSUMURA, TAKAFUMI |
分类号 |
B81B7/02;B60C23/04;B60C23/20;B60G17/00;B81B3/00;B81C1/00;G01C19/56;G01C19/5762;G01C19/5769;G01L9/00;G01L17/00;G01P15/125;G01P15/18;H01L21/3205;H01L21/768;H01L21/8234;H01L27/06;H01L27/08;H01L29/84 |
主分类号 |
B81B7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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