发明名称 DIE FOR INJECTION MOLDING
摘要 A die for injection molding is provided to minimize defects due to residual stress generated during injection molding by forming a plurality of grooves on the upper part of a gate. A die for injection molding comprises a gate of the die for manufacturing a molding product. The gate consists of plural grooves(106) formed at the lower surface of an upper plate to allow a gate area of the molding product manufactured by the die to have plural projections. The plural grooves formed at the lower surface of the upper plate of the gate are shaped like a cylinder, a hemisphere, or a cone. The plural projection parts are placed at the upper surface of a lower plate of the gate to mate to each groove formed at the lower surface of the upper plate of the gate.
申请公布号 KR20080017890(A) 申请公布日期 2008.02.27
申请号 KR20060079688 申请日期 2006.08.23
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, JIN GWAN;KIM, TAE SEOK
分类号 B29C45/27;B29C45/26;B29C45/28;B29C45/30 主分类号 B29C45/27
代理机构 代理人
主权项
地址