LIGHT EMITTING DIODE PACKAGE EMPLOYING LEAD TERMINAL WITH REFLECTING SURFACE

摘要

A light emitting diode package employing a lead terminal with a reflective surface is provided to improve the optical efficiency of the package by reflecting light emitted from an LED chip on a reflecting surface with high reflectivity. A LED package has an LED chip(57) mounted in a cavity to radiate light emitted from the LED chip in a viewing angle. A first lead terminal(51) has a lower portion(51b) with an LED chip mounting area, and at least one wing portion extending from the lower portion to form a reflective surface. A second lead terminal(53) is spaced apart from the first lead terminal, and has a lower portion and at least one wing portion extending from the lower portion to form a reflective surface. A package body(55) supports the first and second lead terminals and defines a cavity through which the LED chip mounting area of the first lead terminal and a part of the second lead terminal are exposed. The first and second lead terminals extend outside of the package body.