发明名称 CHIP MOUNTER AND CHIP MOUNTING SYSTEM HAVING THE SAME
摘要 A chip mounter and a chip mounting system having the same are provided to transport a head by using a plane polar coordinate system. A chip mounter(300) includes a bed(310). A chip supplying unit(370) supplies a chip(80) by being installed on the bed. A substrate transportation unit(350) transports a substrate for the chip to be mounted. A head(340) picks up the chip from the chip supplying unit, and mounts the picked up chip on the substrate, and includes at least one nozzle. At least one head transportation unit(390) is installed on the bed to be connected to the head, and rotates the head around the installation position, and transports the head.
申请公布号 KR20080017558(A) 申请公布日期 2008.02.27
申请号 KR20060078735 申请日期 2006.08.21
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 CHOI, BOO GOAN
分类号 H05K13/04 主分类号 H05K13/04
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