Light emitting diode package employing lead terminal with reflecting surface

摘要

Disclosed is a light emitting diode (LED) package employing a lead terminal with a reflecting surface. The package includes first and second lead terminals (51,53) that are spaced apart from each other. The first lead terminal has a lower portion (51b) with an LED chip mounting area, and at least one reflecting surface (51c,51d) formed by being bent from the lower portion. Meanwhile, a package body (55) supports the first and second lead terminals and forms a cavity through which the LED chip mounting area and the reflecting surface of the first lead terminal and a part of the second lead terminal are exposed. The first and second lead terminals extend outside of the package body. Accordingly, light emitted from an LED chip can be reflected on the reflecting surface with high reflectivity, so that the optical efficiency of the package can be improved.