发明名称 Methods for depositing copper on a noble metal layer of a work piece
摘要 Methods for electrodeposition of copper on a noble metal layer of a work piece are provided. An exemplary method includes exposing the noble metal layer to an electrodeposition composition. The electrodeposition composition comprises a copper salt, a suppressor, an accelerator and an electrolyte. The electrodeposition of copper on a surface of the noble metal layer is initiated by application of a predetermined current density to the work piece. The electrodeposition of copper is terminated upon the occurrence of a predetermined event.
申请公布号 US7335288(B2) 申请公布日期 2008.02.26
申请号 US20030666432 申请日期 2003.09.18
申请人 NOVELLUS SYSTEMS, INC. 发明人 HARDIKAR VISHWAS V.
分类号 C25D3/38;C25D3/00;C25D5/18;C25D5/34;C25D7/12;H01L21/288;H01L21/768 主分类号 C25D3/38
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