发明名称 |
Semiconductor memory integrated circuit and layout method of the same |
摘要 |
A semiconductor memory integrated circuit includes a plurality of pads; a peripheral circuit having a plurality of control circuits which are arranged at locations adjacent to the plurality of the pads and receive a plurality of input signals to generate a plurality of output signals in response to a plurality of control signals, respectively; and a plurality of fuse circuits for generating the plurality of the control signals, said fuse circuits being arranged between the plurality of the pads and the peripheral circuit. Since the integrated circuit has the fuse circuits at a location adjacent to the pads, the characteristics of the IC can be changed even after the package test when a small region is opened.
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申请公布号 |
US7335957(B2) |
申请公布日期 |
2008.02.26 |
申请号 |
US20040918519 |
申请日期 |
2004.08.12 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE HI-CHOON |
分类号 |
H01L23/62;H01L27/14;G11C17/18;G11C29/00;H01L29/00 |
主分类号 |
H01L23/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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