| 摘要 |
A process for producing a die for forming a honeycomb structure having slits having hexagonal honeycomb cell shape 5 at one of surfaces 7 of a plate-like base material for die 2 , and backside holes 4 each communicating with respective slits 5 at the other surface 8 , which comprises the steps of forming holes 3 for dielectric fluid each having an opening diameter smaller than the width of the slit 5 in a predetermined depth at the one of surfaces 7 thereof, and holes 4 communicating with holes 3 at the rest surface 8 ; and then passing a dielectric fluid 10 for electrical discharge machining from the surface 8 to the surface 7 via holes 3 and 4 until the machining proceeds to a position communicating with each hole 4 ; thereby, the slits 5 are formed at the surface 7 of the base material 2.
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