发明名称 Device and method for tilted land grid array interconnects on a coreless substrate package
摘要 An article of manufacture and system, as well as fabrication methods therefore, may include a plurality of lands disposed on a surface of a substrate wherein the lands are oriented at an angle to the surface of the substrate and further wherein the substrate is formed of conductive layers that are formed such that a non-conductive layer does not interpose between the conductive layers and their coupling.
申请公布号 US7335979(B2) 申请公布日期 2008.02.26
申请号 US20040880154 申请日期 2004.06.28
申请人 INTEL CORPORATION 发明人 WALK MICHAEL J.
分类号 H01L23/12;H01L21/48;H01L23/04;H01L23/053;H01L23/498;H05K1/11 主分类号 H01L23/12
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