发明名称 Printed circuit board and camera module
摘要 A printed circuit board has a flexible portion where a covering layer is exposed, and a rigid portion provided by forming a resistant layer on a part of the covering layer. To produce a camera module, a lens unit and a CCD are affixed to the printed circuit board through an adhesive, wherein the CCD is located inside the lens unit. The rigid portion has a top surface that is substantially equal in shape and size to an outline of a bottom surface of the lens unit, so the top surface of the rigid portion serves as a coating area for the adhesive.
申请公布号 US7335414(B2) 申请公布日期 2008.02.26
申请号 US20050293220 申请日期 2005.12.05
申请人 FUJIFILM CORPORATION 发明人 TAKEUCHI SETSU
分类号 H05K1/03;G02B7/02;G03B17/02;H01B17/58;H04N5/225;H04N5/335;H05K1/02;H05K1/14;H05K3/28 主分类号 H05K1/03
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