| 摘要 |
An apparatus and a method for detecting the edge defect of a wafer are provided to prevent the damage of wafer during a process by detecting wafer chipping using a wafer sorting process. An apparatus for detecting the edge defect of wafer includes a turn table(10), defect inspection cameras(100a), and a controller(200). The turn table, which is rotated by a driver, mounts a wafer thereon. The defect inspection cameras photograph the edge of the wafer mounted on the turn table when the turn table is rotated. The controller controls the shut speed of the defect inspection cameras and detects the notch and defect of the wafer based on the photograph result of the defect inspection cameras.
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