发明名称 Thin-film coating apparatus
摘要 To provide a thin-film forming device and a thin-film forming method, a liquid crystal display and a device and method for manufacturing the same, and a thin-film structure and a device and method for manufacturing the same, in which material losses are reduced by using a droplet ejection head, and in addition, the thickness of the entire film can be made uniform. The invention can include a thin-film forming device that is a device for forming a thin film by applying a coating solution onto a substrate, the coating solution containing a solvent and a film-forming material dissolved or dispersed therein. Also an ejection mechanism having a droplet ejection head for ejecting the coating solution onto the substrate, a moving mechanism capable of relatively moving the positions of the droplet ejection head and the substrate, and a control unit for controlling at least one of the ejection mechanism and the moving mechanism can be provided for the thin-film forming device. In addition, a solvent vapor supply mechanism for supplying the solvent vapor to the vicinity of the coating solution applied onto the substrate can also be provided for the thin-film forming device.
申请公布号 US7335604(B2) 申请公布日期 2008.02.26
申请号 US20030365537 申请日期 2003.02.13
申请人 SEIKO EPSON CORPORATION 发明人 SAKURADA KAZUAKI
分类号 B41J2/01;H01L21/469;B05B12/12;B05B13/04;B05B17/06;B05C5/00;B05C9/12;B05D1/26;B05D3/10;G02F1/1333;H01L21/31;H01L51/40 主分类号 B41J2/01
代理机构 代理人
主权项
地址