| 摘要 |
<p>Provided is an imaging device wherein an optical system for collecting light from an object can be easily arranged on a solid-state imaging element, and unnecessary external light other than the light from the object can be surely blocked. The imaging device is provided with the solid-state imaging element (2) which receives light through the light from the object and converts the light into electricity; the optical system (3) which collects the light from the object; and a resin member (5). The solid-state imaging element (2) is provided with a semiconductor chip for receiving the light from the object through a light receiving plane and converting the light into electricity. A light transmitting member is arranged on an upper plane of the semiconductor chip, and an electrode terminal group is arranged on a lower plane of the semiconductor chip. The optical system (3) is arranged on a plane of the light transmitting member in a light receiving region facing the light receiving plane. The resin member (5) reinforces bonding strength between a circuit board (4) whereupon the solid-state imaging element (2) is arranged and the electrode terminal group of the solid-state imaging element (2), and shields regions of the light transmitting member other than the light receiving region from light.</p> |
