| 摘要 |
A method for fabricating a printed circuit board is provided to form a circuit pattern by forming a plating layer on a copper foil by an electrolytic copper plating process after forming a circuit with the copper foil, thereby preventing loss of pattern due to flash etching. A method for fabricating a printed circuit board includes the steps of: preparing a substrate laminated with copper foils(112a) on both surfaces of an insulating layer(111); applying first dry films(116a) on the copper foils, removing the first dry films of the remaining part except the first dry films laminated on the copper foils used as circuit patterns by exposing and developing, and removing the exposed copper foils by removing the first dry films with an etching solution; removing the first dry films on the copper foils, applying second dry films on both surfaces of the substrate of which the copper foils are removed, and removing the second dry films of the remaining part except the removed part of the copper film by exposing and developing; and forming the circuit patterns by forming plating layers on the copper foils.
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