发明名称 |
DEVICE AND METHOD FOR LIQUID TREATMENT OF WAFER-SHAPED ARTICLES |
摘要 |
Method and device for wet treating a defined peripheral edge-region of a wafer-shaped article having a first surface plane W1, a second surface plane W2 and an edge surface. The device comprises a support for holding the wafer-shaped article; liquid dispensing means for dispensing liquid onto said first surface plane W1 of the wafer-shaped article not facing the support and liquid guiding member connected to the support for guiding at least a part of said liquid around the edge surface of the wafer-shaped article towards the second surface plane W2 of the wafer-shaped article facing the support thereby wetting at least the edge surface, wherein said liquid guiding member has the form of a ring. |
申请公布号 |
KR20080017008(A) |
申请公布日期 |
2008.02.25 |
申请号 |
KR20077026379 |
申请日期 |
2006.05.18 |
申请人 |
SEZ AG |
发明人 |
BALDY ANDREAS;GIGACHER MARKUS;BRUGGER MICHAEL |
分类号 |
H01L21/304;H01L21/00;H01L21/02 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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