| 摘要 |
<p>A lead-free and bismuth-free solder alloy composition for electronic assembly applications having reduced toxicity. The alloy composition comprises about 0.01% to about 4.5% silver; about 0.01% to about 3% copper; about 0.002% to about 5.0% antimony; about 85% to about 99% tin and about 0.002% to about 1% of either nickel or cobalt. The alloy composition has a melting temperature of about 217 degree C, with superior wetting and mechanical strength making the alloy composition well suited for electronic circuit board manufacture and lead less component bumping or column arrays, and replacement of conventional tin-lead solders.</p> |
