| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve throughput and exposure accuracy. <P>SOLUTION: The exposure apparatus is provided with a control device capable of switching first exposure control and second exposure control. The first exposure control is performed while reversing the moving direction of a wafer stage in each transfer of a reticle pattern to each of shot areas SA1 to SAn of a wafer W; and the second exposure control is performed for continuously transferring reticle patterns to a plurality of adjacent shot areas SA1 to SAn on the wafer during the movement of the wafer stage to a fixed direction without inverting the moving direction of the wafer stage. <P>COPYRIGHT: (C)2008,JPO&INPIT |
