ELECTROSTATIC CHUCK DEVICE

摘要

PROBLEM TO BE SOLVED: To implement plasma treatment processing having high in-plane uniformity for a plate-like specimen by improving the in-plane uniformity of electric field strength in plasma when it is applied to a plasma treatment apparatus.

SOLUTION: The electrostatic chuck device 21 consists of: an electrostatic chuck section 22 composed of a placing plate 31 having an upper surface 31a as a placing surface for placing the plate-like specimen W, a supporting plate 32, an internal electrode 25 for electrostatic adsorption, and an insulating member 33; a metal base section 23; and a dielectric plate 24. The dielectric plate 24 is fixed in the inside of a recess 34 of the metal base section 23 via a conductive bonding/joining agent 35 having a resistance inherent in volume of not more than 1.0×10-2Ωcm, and the dielectric plate 24 is bonded/joined to the supporting plate 32 of the electrostatic chuck section 22 via an insulative bonding/joining agent 36.

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