| 摘要 |
PROBLEM TO BE SOLVED: To provide copper or a copper alloy material having surface characteristics of a low surface roughness and of fewer fine cracks and having excellent platability, to provide a method for manufacturing the same material, and to provide a semiconductor package employing the same material as a lead frame material. SOLUTION: The copper or the copper alloy material that has a surface roughness of≤0.1μm by arithmetic average roughness (Ra), the maximum height (Rmax) of≤1μm, and fine cracks of≤10 pieces/arbitrary 100μm square on the material surface is manufactured by the steps of: subjecting a copper or a copper alloy material to pre-finish rolling using a roll, which is treated with shot blast and has a surface roughness Ra of 0.1-1μm; and then subjecting the rolled material to finish rolling using a bright roll, which has a surface roughness Ra of <0.1μm, at a total rolling reduction within the range of≥10μm and≤200μm. COPYRIGHT: (C)2008,JPO&INPIT |
