发明名称 DEVICE AND METHOD FOR SEMICONDUCTOR INSPECTION
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor inspection device and a semiconductor inspection method capable of highly precisely detecting the defect of wiring and a diffusion unit. SOLUTION: A data storage unit 10 stores arrangement wiring data on a semiconductor device 15. A data processing unit 11 searches for electron beam irradiation control information and bias voltage information for the semiconductor device 15, based on the arrangement wiring data read out from the data storage unit 10; and inspects a route such as desired wiring by inputting data on substrate current produced when the semiconductor device 15 is irradiated with the electron beam. A vias voltage generating unit 12 gives the semiconductor device 15 bias voltage in response to the bias voltage information. An electron beam controller 13 controls electron beam irradiation for an electron beam sweeping unit 14 using the irradiation control information. The electron beam sweeping unit 14 irradiates the desired wiring of the semiconductor device 15 with the electron beam. A current measuring unit 16 detects substrate current which is produced by electron beam irradiation, and which flows out from the semiconductor device 15. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008041757(A) 申请公布日期 2008.02.21
申请号 JP20060211079 申请日期 2006.08.02
申请人 NEC ELECTRONICS CORP 发明人 NAKAMURA TOYOKAZU
分类号 H01L21/66 主分类号 H01L21/66
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