| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-definition thermal-type infrared imaging device having a hollow structure which realizes superior heat insulating properties, and can be manufactured at low cost and with high yield. SOLUTION: The thermal-type infrared solid-state imaging device 10 is equipped with a substrate 11 which has transistors, an insulating film 12 coating the substrate 11, a dead space 13 bored in the insulating film 12, and a heat detector 16 demarcated in a membrane section 14 above the dead space 13 in the insulating film 12 for infrared detection, along with the transistors. COPYRIGHT: (C)2008,JPO&INPIT
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