| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin film deposition method capable of depositing a fine thin film having a uniform film thickness on a resin-made substrate with the heat-resistant temperature being relatively low. SOLUTION: The temperature inside a hermetic container 1 is raised to the reaction temperature by a heating means 2. Next, a reaction liquid 4 in which a metal complex or an oxide complex forming a raw material of a thin film is mixed with a solvent having the boiling point of≤200°C is heated in a heating atmosphere to generate a raw material gas containing the complex and scatter the raw material gas. A substrate 5 is fed into the raw material gas, and the complex is decomposed to deposit a metal or an oxide on the substrate to form a thin film. COPYRIGHT: (C)2008,JPO&INPIT
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