发明名称 Methods and Systems Employing Tailored Dimples to Enhance Heat Transfer
摘要 A heat sink for cooling a heated component, the heat sink comprising a base coupled to the component. In addition, the heat sink comprises at least one thin-walled heat transfer member extending from the base. The heat transfer member comprises an upstream end and a downstream end defined by a fluid flow direction, and a convective surface extending between the upstream end and the downstream end. Further, the convective surface includes a recessed oval dimple having a major axis and a minor axis. The oval dimple is oriented such that its major axis is at an angle theta relative to the fluid flow direction, wherein the angle theta is between 75° and less than 115°.
申请公布号 US2008043431(A1) 申请公布日期 2008.02.21
申请号 US20070839912 申请日期 2007.08.16
申请人 THE TEXAS A&M UNIVERSITY SYSTEM 发明人 MAROTTA EGIDIO E.;FLETCHER LEROY S.
分类号 H05K7/20 主分类号 H05K7/20
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