发明名称 |
Copper (II) Complexes for Deposition of Copper Films by Atomic Layer Deposition |
摘要 |
The present invention relates to novel 1,3-diimines and 1,3-diimine copper complexes and the use of 1,3-diimine copper complexes for the deposition of copper on substrates or in or on porous solids in an atomic layer deposition process.
|
申请公布号 |
US2008044687(A1) |
申请公布日期 |
2008.02.21 |
申请号 |
US20050658369 |
申请日期 |
2005.07.29 |
申请人 |
BRADLEY ALEXANDER ZAK;THOMPSON JEFFERY SCOTT;PARK KYUNG-HO |
发明人 |
BRADLEY ALEXANDER ZAK;THOMPSON JEFFERY SCOTT;PARK KYUNG-HO |
分类号 |
C07F1/08;B32B9/04;C07C211/22;C23C16/00 |
主分类号 |
C07F1/08 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|