摘要 |
Vapor deposition precursors that can deposit conformal thin ruthenium films on substrates with a very high growth rate, low resistivity and low levels of carbon, oxygen and nitrogen impurities have been provided. The precursors described herein include a compound having the formula CMC', wherein M comprises a metal or a metalloid; C comprises a substituted or unsubstituted acyclic alkene, cycloalkene or cycloalkene-like ring structure; and C' comprises a substituted or unsubstituted acyclic alkene, cycloalkene or cycloalkene-like ring structure; wherein at least one of C and C' further and individually is substituted with a ligand represented by the formula CH(X)R<SUB>1</SUB>, wherein X is a N, P, or S-substituted functional group or hydroxyl, and R<SUB>1</SUB> is hydrogen or a hydrocarbon. Methods of production of the vapor deposition precursors and the resulting films, and uses and end uses of the vapor deposition precursors and resulting films are also described. |
申请人 |
HONEYWELL INTERNATIONAL INC.;THENAPPAN, ALAGAPPAN;LI, CHIEN-WEI;NALEWAJEK, DAVID;CHENEY, MARTIN;LAO, JINGYU;EISENBRAUN, ERIC;LI, MIN;BERLINER, NATHANIEL;RITALA, MIKKO;LESKELA, MARKKU;KUKLI, KAUPO |
发明人 |
THENAPPAN, ALAGAPPAN;LI, CHIEN-WEI;NALEWAJEK, DAVID;CHENEY, MARTIN;LAO, JINGYU;EISENBRAUN, ERIC;LI, MIN;BERLINER, NATHANIEL;RITALA, MIKKO;LESKELA, MARKKU;KUKLI, KAUPO |