| 摘要 |
<p>The present disclosure relates to heat transfer thermal management device utilizing varied methods of heat transfer to cool a heat generating component (1) from a circuit assembly or any other embodiment where a heat generating component (1) can be functionally and operatively coupled. In a proposed embodiment, at least one heat pipe (4) is used to transfer heat from the condensation portion (3) of a vapor chamber (2) to cool a bottom portion of a finned heat dissipation space (6) and transfer the heat to a colder location on the heat fins (5). In another proposed embodiment, the water vapor chamber (2) is placed in a heat sink (102) and is adapted to thermally connect to at least one heat pipe (4).</p> |
