<p>A seal process step wherein a composite material is applied on an integrated circuit package which may include an integrated circuit that is mounted over another integrated circuit for two or more repeating layers and finally mounted to a substrate. The uniform seal created by the composite material form the mechanical bonding between two surfaces and may inhibit cracking of the integrated circuit (die) during thermo-mechanical loading. The distinctive features of these dies are that, each die has the connecting pads residing at the edge of the die. The introduction of Edge Bond Chip Connection is to make electrical connection at the sides of the dies connecting the pads at the edges.</p>
