发明名称 CAMERA MODULE FOR MOBILE DEVICE
摘要 A camera module for a mobile device is provided to prevent adhesives, applied in the process of assembly, from running down the external of a housing by reducing the size of a PCB(Printed Circuit Board) and forming a stepped portion on the boundary between the housing and the PCB so that some of the adhesives, running down the external of the housing, can fill up the space of the stepped portion. A camera module(1) comprises a housing(10), an image pickup element(50), a PCB(60), and an FPCB(Flexible PCB)(65). The image pickup element(50), installed in the housing(10), acquires an image. The PCB(60) is attached to the bottom of the housing(10). The PCB(60) is formed at a reduced size so that a sill can be formed at the lower part of the PCB(60). The FPCB(65), attached to the lower surface of the PCB(60), comprises a reduced jointing surface so that a sill can be formed at the lower part of the FPCB(65).
申请公布号 KR20080016054(A) 申请公布日期 2008.02.21
申请号 KR20060077618 申请日期 2006.08.17
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 AN, JONG SU;JUNG, WOONG TAE
分类号 H04N5/225 主分类号 H04N5/225
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