| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a metal layer-laminated polyimide film which causes little volatilization of a resolvent derived from a polymer in the case of being machined or used at a high temperature, is excellent in planarity and homogeneity, and has little peeling or wrinkles, and a printed wiring board where a metal layer laminated polyimide film is circuit-processed. <P>SOLUTION: In the manufacturing method for the metal layer-laminated polyimide film, the polyimide film having an amount of a resolvent derived from the polymer of 0.01 to 10 ppm is used as the base material film, and the metal layer is formed on at least one side of the base material film by a dry type film forming method. In the metal layer laminated polyimide film, the amount of the resolvent derived from the polymer in the metal layer laminated polyimide film is 0.01 ppm or more and 1 ppm or less. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
