| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board which enables the manufacture of a device resin-sealed in the air with improved sealing reliability, easily with a high yield, and also to provide the device and its manufacturing method. <P>SOLUTION: On a wiring board 1, a plurality of wiring patterns 2 are so formed as to project by a predetermined height from the surface of the wiring board 1. On the wiring board 1, a device chip 3 is mounted face down so that a functional surface region 4 and electrode pads may face the side of the wiring board 1. so as to form a space 6 between the functional surface region 4 and the wiring board 1, the wiring patterns 2 are formed from outside a region opposite to the functional surface region 4, so that they are not extended into the opposite region. Moreover, the wiring patterns 2 are formed at least at such locations as to correspond to Au bumps 5 of the device chip 3, and steps are formed in the wiring board 1 below the device chip 3 by the end parts of the wiring patterns 2. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
