| 摘要 |
PROBLEM TO BE SOLVED: To eliminate clogging due to a dried conductive paste at the tip of a glass pipette in a state waiting for correction by using a simple structure without adding a work process and remove dust near the tip of the glass pipette. SOLUTION: A wiring board correction method applies a conductive paste 4 to a disconnection part 3b of a wiring pattern 3a formed on a wiring board from the tip of a glass pipette 5 filled with the conductive paste 4 for correction. Even in the state for waiting this correction, this conductive paste 4 is jetted from the tip of this glass pipette 5 to prevent the tip of the glass pipette 5 from clogging due to the dried conductive paste 4. COPYRIGHT: (C)2008,JPO&INPIT
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