SOLDERING METHOD AND SOLDERING EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To achieve a high-reliability flip-chip connection. SOLUTION: A processed object 16 before flip-chip connection has an intermediate substrate 100 and a semiconductor chip 102 facing each other with a space 110 between them and four spacers 112 located among them. This processed object 16 is first exposed to hydrogen radical H*in the oxide film elimination step. This reduces and eliminates an oxide film formed on surfaces of respective electrodes 104 and 106 and a solder bump 108. In the following alignment step, the spacers 112 are molten, and the intermediate substrate 100 and semiconductor chip 102 are aligned. Further, in the joining step, the solder bump 108 is molten, and soldering is done. Since these steps are carried out in succession in a chamber located in a hypoxic atmosphere, there are no worries about oxidation, thus realizing reliable flip-chip connection. COPYRIGHT: (C)2008,JPO&INPIT