发明名称 FILM DEPOSITION APPARATUS, FILM DEPOSITION SYSTEM, AND FILM DEPOSITION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a film deposition system having a small footprint and high productivity which is capable of avoiding cross contamination in each layer formed in a manufacturing process of an organic EL element or the like. SOLUTION: A film deposition apparatus 13 for performing the film deposition on a substrate G has a first film deposition mechanism 35 for depositing a first layer and a second film deposition mechanism 36 for depositing a second layer in a processing container 30. The first film deposition mechanism 35 comprises a nozzle 34 which is arranged inside the processing container 30 to feed a vapor of a film deposition material to the substrate, a vapor generation unit 45 which is arranged outside the processing container to generate the vapor of the film deposition material, and a pipe 46 for feeding the vapor of the film deposition material generated in the vapor generation unit 45 to the nozzle 34. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008038225(A) 申请公布日期 2008.02.21
申请号 JP20060216802 申请日期 2006.08.09
申请人 TOKYO ELECTRON LTD 发明人 MOYAMA KAZUKI;NOZAWA TOSHIHISA
分类号 C23C14/24;C23C14/06;C23C14/34;C23C14/56;H01L51/50;H05B33/10 主分类号 C23C14/24
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